Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12356554 | Method for manufacturing bonded body and method for manufacturing insulation circuit substrate | Takeshi Kitahara | 2025-07-08 |
| 11908768 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo | 2024-02-20 |
| 11462456 | Power-module substrate with heat-sink | Sotaro Oi | 2022-10-04 |
| 11322424 | Insulation circuit board with heat sink | Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo | 2022-05-03 |
| 11302602 | Power-module substrate with heat-sink | Sotaro Oi | 2022-04-12 |
| 11289400 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo | 2022-03-29 |
| 11289390 | Insulation circuit board with heat sink | Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo | 2022-03-29 |
| 11013107 | Insulated circuit board | Takeshi Kitahara, Yoshiyuki Nagatomo | 2021-05-18 |