Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908768 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Takeshi Kitahara, Yoshiyuki Nagatomo | 2024-02-20 |
| 11735434 | Method for producing insulating circuit substrate with heat sink | Ryouhei Yumoto, Takeshi Kitahara, Yoshiyuki Nagatomo | 2023-08-22 |
| 11676882 | Method of manufacturing power module substrate board and ceramic-copper bonded body | Takeshi Kitahara, Yoshiyuki Nagatomo | 2023-06-13 |
| 11476127 | Manufacturing method of electronic-component-mounted module | Sotaro Oi | 2022-10-18 |
| 11355415 | Heat sink-attached power module substrate board and power module | Sotaro Oi | 2022-06-07 |
| 11322424 | Insulation circuit board with heat sink | Ryohei Yumoto, Takeshi Kitahara, Yoshiyuki Nagatomo | 2022-05-03 |
| 11315868 | Electronic-component-mounted module design to reduce linear expansion coefficient mismatches | Sotaro Oi | 2022-04-26 |
| 11289400 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Takeshi Kitahara, Yoshiyuki Nagatomo | 2022-03-29 |
| 11289390 | Insulation circuit board with heat sink | Ryohei Yumoto, Takeshi Kitahara, Yoshiyuki Nagatomo | 2022-03-29 |
| 10607915 | Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device | Sotaro Oi, Kimihito Nishikawa | 2020-03-31 |
| 10453772 | Heat-sink-attached power-module substrate and power module | Sotaro Oi | 2019-10-22 |
| 10211068 | Power-module substrate with cooler and method of producing the same | Sotaro Oi, Takeshi Kitahara | 2019-02-19 |
| 10068829 | Power-module substrate unit and power module | Sotaro Oi | 2018-09-04 |
| 10032648 | Method of manufacturing power-module substrate with heat-sink | Sotaro Oi | 2018-07-24 |
| 9837363 | Power-module substrate unit and power module | Sotaro Oi | 2017-12-05 |
| 9579739 | Manufacturing method of power-module substrate | Sotaro Oi, Kimihito Nishikawa, Hiromasa Hayashi | 2017-02-28 |