Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607915 | Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device | Tomoya Oohiraki, Sotaro Oi | 2020-03-31 |
| 10375825 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Nobuyuki Terasaki, Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2019-08-06 |
| 9579739 | Manufacturing method of power-module substrate | Tomoya Oohiraki, Sotaro Oi, Hiromasa Hayashi | 2017-02-28 |
| 9504144 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Nobuyuki Terasaki, Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2016-11-22 |
| 9355986 | Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer | Shuji Nishimoto, Yoshiyuki Nagatomo | 2016-05-31 |