Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199006 | Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate | Yoshiyuki Nagatomo | 2025-01-14 |
| 12168634 | Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method | — | 2024-12-17 |
| 12125765 | Copper/ceramic joined body and insulating circuit substrate | — | 2024-10-22 |
| 12089342 | Insulated circuit board | Akira Sakurai | 2024-09-10 |
| 12037294 | Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method | — | 2024-07-16 |
| 12035468 | Bonded body, insulated circuit board with heat sink, and heat sink | — | 2024-07-09 |
| 12027434 | Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method | — | 2024-07-02 |
| 12002732 | Copper/ceramic assembly, insulated circuit board, method for producing copper/ceramic assembly, and method for producing insulated circuit board | — | 2024-06-04 |
| 11887909 | Copper/titanium/aluminum joint, insulating circuit substrate, insulating circuit substrate with heat sink, power module, LED module, and thermoelectric module | — | 2024-01-30 |
| 11881439 | Copper/ceramic joined body, insulating circuit substrate, copper/ceramic joined body production method, and insulating circuit substrate production method | — | 2024-01-23 |
| 11798856 | Ceramic/aluminum bonded body, insulating substrate, LED module, ceramic member, method for producing ceramic/aluminum bonded body, and method for producing insulating substrate | — | 2023-10-24 |
| 11638350 | Copper/ceramic bonded body, insulating circuit board, method for producing copper/ceramic bonded body, and method for producing insulating circuit board | — | 2023-04-25 |
| 11396059 | Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method | — | 2022-07-26 |
| 11393738 | Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate | Yoshiyuki Nagatomo | 2022-07-19 |
| 11177186 | Bonded body and insulated circuit board | — | 2021-11-16 |
| 11094606 | Bonded body, insulated circuit board with heat sink, and heat sink | — | 2021-08-17 |
| 11062974 | Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate | Yoshiyuki Nagatomo | 2021-07-13 |
| 11028022 | Copper-ceramic bonded body and insulation circuit substrate | — | 2021-06-08 |
| 10998250 | Bonded body and insulating circuit substrate | — | 2021-05-04 |
| 10818585 | Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit board | — | 2020-10-27 |
| 10798824 | Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion module | Toyo Ohashi | 2020-10-06 |
| 10607907 | Ceramic-aluminum conjugate, power module substrate, and power module | Yoshirou Kuromitsu, Kazuhiro Akiyama, Toshiyuki Nagase, Yoshiyuki Nagatomo, Yuichi Ikuhara +2 more | 2020-03-31 |
| 10600719 | Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink | Yoshiyuki Nagatomo | 2020-03-24 |
| 10526252 | Ceramic/aluminum joined body, insulating circuit board, power module, LED module, and thermoelectric module | Yoshiyuki Nagatomo | 2020-01-07 |
| 10497585 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Yoshiyuki Nagatomo | 2019-12-03 |