Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497637 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Yoshiyuki Nagatomo | 2019-12-03 |
| 10410951 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Yoshiyuki Nagatomo | 2019-09-10 |
| 10375825 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Yoshiyuki Nagatomo, Kimihito Nishikawa, Yoshirou Kuromitsu | 2019-08-06 |
| 10370303 | Process for producing bonded body and process for producing power module substrate | Yoshiyuki Nagatomo | 2019-08-06 |
| 10319664 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Yoshiyuki Nagatomo | 2019-06-11 |
| 10283431 | Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink | Yoshiyuki Nagatomo | 2019-05-07 |
| 10199237 | Method for manufacturing bonded body and method for manufacturing power-module substrate | Yoshiyuki Nagatomo | 2019-02-05 |
| 10173282 | Bonded body and power module substrate | Yoshiyuki Nagatomo | 2019-01-08 |
| 10103035 | Copper-ceramic bonded body and power module substrate | Yoshiyuki Nagatomo | 2018-10-16 |
| 10016956 | Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate | Yoshiyuki Nagatomo | 2018-07-10 |
| 10011093 | Bonding structure of aluminum member and copper member | Yoshiyuki Nagatomo | 2018-07-03 |
| 9968012 | Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate | Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2018-05-08 |
| 9905437 | Method of producing bonded body and method of producing power module substrate | Yoshiyuki Nagatomo | 2018-02-27 |
| 9833855 | Method for manufacturing power module substrate | Yoshiyuki Nagatomo | 2017-12-05 |
| 9807865 | Substrate for power modules, substrate with heat sink for power modules, and power module | Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2017-10-31 |
| 9786577 | Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module | Yoshiyuki Nagatomo | 2017-10-10 |
| 9764416 | Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module | Toshiyuki Nagase, Yoshiyuki Nagatomo | 2017-09-19 |
| 9735085 | Bonded body, power module substrate, power module and method for producing bonded body | Yoshiyuki Nagatomo | 2017-08-15 |
| 9723707 | Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate | Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2017-08-01 |
| 9648737 | Bonded body and power module substrate | Yoshiyuki Nagatomo | 2017-05-09 |
| 9560755 | Bonding body, power module substrate, and heat-sink-attached power module substrate | Yoshiyuki Nagatomo | 2017-01-31 |
| 9530717 | Bonded body and power module substrate | Yoshiyuki Nagatomo | 2016-12-27 |
| 9504144 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Yoshiyuki Nagatomo, Kimihito Nishikawa, Yoshirou Kuromitsu | 2016-11-22 |
| 9480144 | Power module substrate, power module substrate with heat sink, and power module | Yoshiyuki Nagatomo, Yoshirou Kuromitsu | 2016-10-25 |
| 9414512 | Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module | Yoshiyuki Nagatomo, Kazuhiro Akiyama, Hiroshi Tonomura, Yoshirou Kuromitsu | 2016-08-09 |