Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5675474 | Highly heat-radiating ceramic package | Yoshio Kanda, Yoshiro Kuromitu, Masafumi Hatsushika, Hirokazu Tanaka | 1997-10-07 |
| 5096768 | Substrate used for fabrication of thick film circuit | Yoshirou Kuromitsu, Hideaki Yoshida, Hiroto Uchida, Tadaharu Tanaka, Yoshio Kanda +1 more | 1992-03-17 |
| 5087509 | Substrate used for fabrication of thick film circuit | Yoshirou Kuromitsu, Hideaki Yoshida, Tadaharu Tanaka, Yoshio Kanda | 1992-02-11 |