Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319664 | Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink | Nobuyuki Terasaki | 2019-06-11 |
| 10283431 | Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink | Nobuyuki Terasaki | 2019-05-07 |
| 10199237 | Method for manufacturing bonded body and method for manufacturing power-module substrate | Nobuyuki Terasaki | 2019-02-05 |
| 10173282 | Bonded body and power module substrate | Nobuyuki Terasaki | 2019-01-08 |
| 10103035 | Copper-ceramic bonded body and power module substrate | Nobuyuki Terasaki | 2018-10-16 |
| 10016956 | Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate | Nobuyuki Terasaki | 2018-07-10 |
| 10011093 | Bonding structure of aluminum member and copper member | Nobuyuki Terasaki | 2018-07-03 |
| 9966353 | Power module substrate, method of producing same, and power module | Shuji Nishimoto | 2018-05-08 |
| 9968012 | Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate | Nobuyuki Terasaki, Yoshirou Kuromitsu | 2018-05-08 |
| 9953944 | Power module | Toyo Ohashi | 2018-04-24 |
| 9941235 | Power module substrate with Ag underlayer and power module | Shuji Nishimoto | 2018-04-10 |
| 9905437 | Method of producing bonded body and method of producing power module substrate | Nobuyuki Terasaki | 2018-02-27 |
| 9833855 | Method for manufacturing power module substrate | Nobuyuki Terasaki | 2017-12-05 |
| 9807865 | Substrate for power modules, substrate with heat sink for power modules, and power module | Nobuyuki Terasaki, Yoshirou Kuromitsu | 2017-10-31 |
| 9786577 | Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module | Nobuyuki Terasaki | 2017-10-10 |
| 9764416 | Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module | Toshiyuki Nagase, Nobuyuki Terasaki | 2017-09-19 |
| 9735085 | Bonded body, power module substrate, power module and method for producing bonded body | Nobuyuki Terasaki | 2017-08-15 |
| 9723707 | Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate | Nobuyuki Terasaki, Yoshirou Kuromitsu | 2017-08-01 |
| 9693449 | Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part | Shuji Nishimoto | 2017-06-27 |
| 9648737 | Bonded body and power module substrate | Nobuyuki Terasaki | 2017-05-09 |
| 9642275 | Power module | Touyou Ohashi, Toshiyuki Nagase, Yoshirou Kuromitsu | 2017-05-02 |
| 9560755 | Bonding body, power module substrate, and heat-sink-attached power module substrate | Nobuyuki Terasaki | 2017-01-31 |
| 9530717 | Bonded body and power module substrate | Nobuyuki Terasaki | 2016-12-27 |
| 9504144 | Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste | Nobuyuki Terasaki, Kimihito Nishikawa, Yoshirou Kuromitsu | 2016-11-22 |
| 9480144 | Power module substrate, power module substrate with heat sink, and power module | Nobuyuki Terasaki, Yoshirou Kuromitsu | 2016-10-25 |