Issued Patents All Time
Showing 76–100 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7298024 | Transparent amorphous carbon structure in semiconductor devices | Zhiping Yin, David Williams | 2007-11-20 |
| 7279118 | Compositions of matter and barrier layer compositions | Zhiping Yin | 2007-10-09 |
| 7273793 | Methods of filling gaps using high density plasma chemical vapor deposition | Neal R. Rueger, William Budge, Gurtej S. Sandhu | 2007-09-25 |
| 7259079 | Methods for filling high aspect ratio trenches in semiconductor layers | Jingyi Bai, William Budge | 2007-08-21 |
| 7253076 | Methods for forming and integrated circuit structures containing ruthenium and tungsten containing layers | Vishnu K. Agarwal, Garo Derderian, Gurtej S. Sandhu, Mark Visokay, Cem Basceri +1 more | 2007-08-07 |
| 7235499 | Semiconductor processing methods | John Qiang Li | 2007-06-26 |
| 7220683 | Transparent amorphous carbon structure in semiconductor devices | Zhiping Yin, David Williams | 2007-05-22 |
| 7214618 | Technique for high efficiency metalorganic chemical vapor deposition | Sam Yang | 2007-05-08 |
| 7205248 | Method of eliminating residual carbon from flowable oxide fill | Li Li | 2007-04-17 |
| 7202183 | Method of filling gaps and methods of depositing materials using high density plasma chemical vapor deposition | Neal R. Rueger, William Budge, Gurtej S. Sandhu | 2007-04-10 |
| 7186638 | Passivation processes for use with metallization techniques | — | 2007-03-06 |
| 7132201 | Transparent amorphous carbon structure in semiconductor devices | Zhiping Yin | 2006-11-07 |
| 7129180 | Masking structure having multiple layers including an amorphous carbon layer | Gurtej S. Sandhu, Zhiping Yin | 2006-10-31 |
| 7078356 | Low K interlevel dielectric layer fabrication methods | Zhiping Yin, William Budge | 2006-07-18 |
| 7067415 | Low k interlevel dielectric layer fabrication methods | Zhiping Yin, William Budge | 2006-06-27 |
| 7067414 | Low k interlevel dielectric layer fabrication methods | Zhiping Yin, William Budge | 2006-06-27 |
| 7060637 | Methods of forming intermediate semiconductor device structures using spin-on, photopatternable, interlayer dielectric materials | Gurtej S. Sandhu | 2006-06-13 |
| 7056833 | Methods of filling gaps and methods of depositing materials using high density plasma chemical vapor deposition | Neal R. Rueger, William Budge, Gurtej S. Sandhu | 2006-06-06 |
| 7053010 | Methods of depositing silicon dioxide comprising layers in the fabrication of integrated circuitry, methods of forming trench isolation, and methods of forming arrays of memory cells | Gurtej S. Sandhu | 2006-05-30 |
| 7018469 | Atomic layer deposition methods of forming silicon dioxide comprising layers | Li Li, Gurtej S. Sandhu | 2006-03-28 |
| 7008885 | Chemical treatment of semiconductor substrates | Li Li | 2006-03-07 |
| 6982207 | Methods for filling high aspect ratio trenches in semiconductor layers | Jingyi Bai, William Budge | 2006-01-03 |
| 6951709 | Method of fabricating a semiconductor multilevel interconnect structure | — | 2005-10-04 |
| 6936547 | Gas delivery system for deposition processes, and methods of using same | Neal R. Rueger, Li Li, Ross S. Dando, Kevin Hamer, Allen Mardian | 2005-08-30 |
| 6930058 | Method of depositing a silicon dioxide comprising layer doped with at least one of P, B and Ge | Chris Hill, Gurtej S. Sandhu | 2005-08-16 |