Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6342789 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood | 2002-01-29 |
| 6342912 | Laser marking techniques | — | 2002-01-29 |
| 6320201 | Semiconductor reliability test chip | Raymond P. Scholer, Fernando Gonzalez | 2001-11-20 |
| 6217949 | Laser marking techniques | — | 2001-04-17 |
| 6157046 | Semiconductor reliability test chip | Raymond P. Scholer, Fernando Gonzalez | 2000-12-05 |
| 6113992 | Laser making techniques | — | 2000-09-05 |
| 6108026 | Laser marking techniques | — | 2000-08-22 |
| 6091250 | Discrete die burn-in for nonpackaged die | Alan G. Wood, Gary L. Chadwick, Chender Huang, Larry D. Kinsman | 2000-07-18 |
| 6091251 | Discrete die burn-in for nonpackaged die | Alan G. Wood, Gary L. Chadwick, Chender Huang, Larry D. Kinsman | 2000-07-18 |
| 6091254 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood | 2000-07-18 |
| 6087845 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood, Warren M. Farnworth | 2000-07-11 |
| RE36469 | Packaging for semiconductor logic devices | Alan G. Wood | 1999-12-28 |
| 5985377 | Laser marking techniques | — | 1999-11-16 |
| RE36325 | Directly bonded SIMM module | Alan G. Wood | 1999-10-05 |
| 5945733 | Structure for attaching a semiconductor wafer section to a support | Walter L. Moden | 1999-08-31 |
| 5936260 | Semiconductor reliability test chip | Raymond P. Scholer, Fernando Gonzalez | 1999-08-10 |
| 5910640 | Electrical contact assembly for use in a multi-die encapsulation device | Warren M. Farnworth, Alan G. Wood | 1999-06-08 |
| 5905382 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood | 1999-05-18 |
| 5859539 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood, Warren M. Farnworth | 1999-01-12 |
| 5838361 | Laser marking techniques | — | 1998-11-17 |
| 5781022 | Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die | Alan G. Wood, Trung T. Doan, Warren M. Farnworth | 1998-07-14 |
| 5767443 | Multi-die encapsulation device | Warren M. Farnworth, Alan G. Wood | 1998-06-16 |
| 5751015 | Semiconductor reliability test chip | Raymond P. Scholer, Fernando Gonzalez | 1998-05-12 |
| 5726580 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood, Warren M. Farnworth | 1998-03-10 |
| 5663654 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood, Warren M. Farnworth | 1997-09-02 |