Issued Patents All Time
Showing 51–59 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5656551 | Method for attaching a semiconductor die to a support | Walter L. Moden | 1997-08-12 |
| 5585282 | Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor | Alan G. Wood, Trung T. Doan, Warren M. Farnworth | 1996-12-17 |
| 5548160 | Method and structure for attaching a semiconductor die to a lead frame | Walter L. Moden | 1996-08-20 |
| 5539324 | Universal wafer carrier for wafer level die burn-in | Alan G. Wood | 1996-07-23 |
| 5302891 | Discrete die burn-in for non-packaged die | Alan G. Wood, Gary L. Chadwick, Chender Huang, Larry D. Kinsman | 1994-04-12 |
| 5138434 | Packaging for semiconductor logic devices | Alan G. Wood | 1992-08-11 |
| 4992849 | Directly bonded board multiple integrated circuit module | Alan G. Wood | 1991-02-12 |
| 4992850 | Directly bonded simm module | Alan G. Wood | 1991-02-12 |
| 4899107 | Discrete die burn-in for nonpackaged die | Alan G. Wood | 1990-02-06 |