Patent Leaderboard
USPTO Patent Rankings Data through Sept 30, 2025
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Thomas A. Figura

Micron: 86 patents #177 of 6,345Top 3%
MTMircon Technology: 1 patents #1 of 36Top 3%
Boise, ID: #89 of 3,546 inventorsTop 3%
Idaho: #120 of 8,810 inventorsTop 2%
Overall (All Time): #18,789 of 4,157,543Top 1%
88 Patents All Time

Issued Patents All Time

Showing 51–75 of 88 patents

Patent #TitleCo-InventorsDate
6225208 Method and structure for improved alignment tolerance in multiple, singularized plugs 2001-05-01
6180452 Shared length cell for improved capacitance 2001-01-30
6146961 Processing methods of forming a capacitor Thomas M. Graettinger, Paul J. Schuele, Pierre C. Fazan, Li Li, Zhiqiang Wu +1 more 2000-11-14
6143620 Semiconductor processing method of providing a roughened polysilicon film and a capacitor construction Sujit Sharan 2000-11-07
6117764 Use of a plasma source to form a layer during the formation of a semiconductor device Kevin G. Donohoe, Thomas J. Dunbar 2000-09-12
6100156 Method for forming a contact intermediate two adjacent electrical components Pai-Hung Pan 2000-08-08
6066552 Method and structure for improved alignment tolerance in multiple, singularized plugs 2000-05-23
6048763 Integrated capacitor bottom electrode with etch stop layer Trung T. Doan 2000-04-11
6049101 Processing methods of forming a capacitor, and capacitor construction Thomas M. Graettinger, Paul J. Schuele, Pierre C. Fazan, Li Li, Zhiqiang Wu +1 more 2000-04-11
6027970 Method of increasing capacitance of memory cells incorporating hemispherical grained silicon Sujit Sharan, Anand Srinivasan, Gurtej S. Sandhu 2000-02-22
6025624 Shared length cell for improved capacitance 2000-02-15
5985732 Method of forming integrated stacked capacitors with rounded corners Pierre C. Fazan, Klaus Schuegraf 1999-11-16
5972771 Enhancing semiconductor structure surface area using HSG and etching 1999-10-26
5963804 Method of making a doped silicon structure with impression image on opposing roughened surfaces Zhiquiang Wu, Li Li 1999-10-05
5950092 Use of a plasma source to form a layer during the formation of a semiconductor device Kevin G. Donohoe, Thomas J. Dunbar 1999-09-07
5933727 Method for increasing capacitance of an HSG rugged capacitor using a phosphine rich oxidation and subsequent wet etch 1999-08-03
5891768 Method of forming a capacitor Pierre C. Fazan 1999-04-06
5888881 Method of trench isolation during the formation of a semiconductor device Nanseng Jeng 1999-03-30
5889300 Capacitor with containers members Pierre C. Fazan 1999-03-30
5872033 Method for increasing capacitance of an HSG rugged capacitor using a phosphine rich oxidation and subsequent wet etch 1999-02-16
5856007 Method and apparatus for forming features in holes, trenches and other voids in the manufacturing of microelectronic devices Sujit Sharan 1999-01-05
5849624 Method of fabricating a bottom electrode with rounded corners for an integrated memory cell capacitor Pierre C. Fazan, Klaus Schuegraf 1998-12-15
5837596 Field oxide formation by oxidation of polysilicon layer Nanseng Jeng 1998-11-17
5837378 Method of reducing stress-induced defects in silicon Viju K. Mathews, Nanseng Jeng, Pierre C. Fazan 1998-11-17
5830793 Method of selective texfturing for patterned polysilicon electrodes Klaus Schuegraf, Pierre C. Fazan 1998-11-03