SS

Sujit Sharan

Micron: 132 patents #93 of 6,345Top 2%
IN Intel: 64 patents #439 of 30,777Top 2%
Applied Materials: 7 patents #1,721 of 7,310Top 25%
📍 Chandler, AZ: #4 of 3,331 inventorsTop 1%
🗺 Arizona: #30 of 32,909 inventorsTop 1%
Overall (All Time): #3,427 of 4,157,543Top 1%
198
Patents All Time

Issued Patents All Time

Showing 176–198 of 198 patents

Patent #TitleCo-InventorsDate
5977636 Method of forming an electrically conductive contact plug, method of forming a reactive or diffusion barrier layer over a substrate, integrated circuitry, and method of forming a layer of titanium boride 1999-11-02
5976976 Method of forming titanium silicide and titanium by chemical vapor deposition Trung T. Doan, Gurtej S. Sandhu, Kirk D. Prall 1999-11-02
5963832 Removal of metal cusp for improved contact fill Anand Srinivasan, Gurtej S. Sandhu 1999-10-05
5946594 Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants Ravi Iyer 1999-08-31
5935336 Apparatus to increase gas residence time in a reactor Gurtej S. Sandhu, Ravi Iyer 1999-08-10
5929526 Removal of metal cusp for improved contact fill Anand Srinivasan, Gurtej S. Sandhu 1999-07-27
5882978 Methods of forming a silicon nitride film, a capacitor dielectric layer and a capacitor Anand Srinivasan, Gurtej S. Sandhu 1999-03-16
5861344 Facet etch for improved step coverage of integrated circuit contacts Ceredig Roberts, Anand Srinivasan, Gurtej S. Sandhu 1999-01-19
5856007 Method and apparatus for forming features in holes, trenches and other voids in the manufacturing of microelectronic devices Thomas A. Figura 1999-01-05
5846881 Low cost DRAM metallization Gurtej S. Sandhu 1998-12-08
5831334 Field effect transistors comprising electrically conductive plugs having monocrystalline and polycrystalline silicon Kirk D. Prall, Pai-Hung Pan 1998-11-03
5759905 Semiconductor processing method of forming a conductively doped semiconductive material plug within a contact opening Pai-Hung Pan, Kirk D. Prall 1998-06-02
5750012 Multiple species sputtering for improved bottom coverage and improved sputter rate P. J. Ireland, Howard E. Rhodes, Sukesh Sandhu, Tim O'Brien, Tim Johnson 1998-05-12
5747116 Method of forming an electrical contact to a silicon substrate Gurtej S. Sandhu 1998-05-05
5735960 Apparatus and method to increase gas residence time in a reactor Gurtej S. Sandhu, Ravi Iyer 1998-04-07
5730835 Facet etch for improved step coverage of integrated circuit contacts Ceredig Roberts, Anand Srinivasan, Gurtej S. Sandhu 1998-03-24
5731235 Methods of forming a silicon nitrite film, a capacitor dielectric layer and a capacitor Anand Srinivasan, Gurtej S. Sandhu 1998-03-24
5700716 Method for forming low contact resistance contacts, vias, and plugs with diffusion barriers Varatharajan Nagabushnam 1997-12-23
5677573 Field effect transistor Kirk D. Prall, Pai-Hung Pan 1997-10-14
5664988 Process of polishing a semiconductor wafer having an orientation edge discontinuity shape Hugh E. Stroupe, Gurtej S. Sandhu 1997-09-09
5644166 Sacrificial CVD germanium layer for formation of high aspect ratio submicron VLSI contacts Jeffrey W. Honeycutt 1997-07-01
5637518 Method of making a field effect transistor having an elevated source and an elevated drain Kirk D. Prall, Pai-Hung Pan 1997-06-10
5533924 Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers Hugh E. Stroupe, Gurtej S. Sandhu 1996-07-09