Issued Patents All Time
Showing 51–60 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6337511 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2002-01-08 |
| 6316823 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2001-11-13 |
| 6269742 | Method and stencil for extruding material on a substrate | Chad A. Cobbley | 2001-08-07 |
| 6248611 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2001-06-19 |
| 6150717 | Direct die contact (DDC) semiconductor package | Alan G. Wood, Warren M. Farnworth, Salman Akram | 2000-11-21 |
| 6107122 | Direct die contact (DDC) semiconductor package | Alan G. Wood, Warren M. Farnworth, Salman Akram | 2000-08-22 |
| 6089151 | Method and stencil for extruding material on a substrate | Chad A. Cobbley | 2000-07-18 |
| 5981102 | Thin profile battery apparatus, battery powerable apparatus, radio frequency communication device, and method of forming battery powerable apparatus | Rickie C. Lake | 1999-11-09 |
| 5959347 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 1999-09-28 |
| 5840598 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 1998-11-24 |