Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787396 | Method of manufacturing LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2004-09-07 |
| 6746899 | Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | — | 2004-06-08 |
| 6740962 | Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | — | 2004-05-25 |
| 6706374 | Stereolithographically marked semiconductor devices and methods | James M. Ocker, Rick A. Leininger | 2004-03-16 |
| 6703105 | Stereolithographically marked semiconductor devices and methods | James M. Ocker, Rick A. Leininger | 2004-03-09 |
| 6653721 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2003-11-25 |
| 6637638 | System for fabricating solder bumps on semiconductor components | Warren M. Farnworth | 2003-10-28 |
| 6635333 | Stereolithographically marked semiconductor devices and methods | James M. Ocker, Rick A. Leininger | 2003-10-21 |
| 6630730 | Semiconductor device assemblies including interposers with dams protruding therefrom | — | 2003-10-07 |
| 6622380 | Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards | — | 2003-09-23 |
| 6602430 | Methods for finishing microelectronic device packages | Steven P. Nally, Vernon Williams | 2003-08-05 |
| 6585927 | Methods for labeling semiconductor device components | James M. Ocker, Rick A. Leininger | 2003-07-01 |
| 6584897 | Method and stencil for extruding material on a substrate | Chad A. Cobbley | 2003-07-01 |
| 6562661 | Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same | — | 2003-05-13 |
| 6548897 | Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad | — | 2003-04-15 |
| 6534342 | Method of manufacturing LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2003-03-18 |
| 6531335 | Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods | — | 2003-03-11 |
| 6506681 | Thin flip—chip method | Timothy L. Jackson | 2003-01-14 |
| 6506671 | Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad | — | 2003-01-14 |
| 6489007 | Stereolithographically marked semiconductor devices and methods | James M. Ocker, Rick A. Leininger | 2002-12-03 |
| 6427587 | Method and stencil for extruding material on a substrate | Chad A. Cobbley | 2002-08-06 |
| 6391680 | LOC semiconductor assembled with room temperature adhesive | Warren M. Farnworth | 2002-05-21 |
| 6379991 | Encapsulation methods for semiconductive die packages | Joseph Brand | 2002-04-30 |
| 6372624 | Method for fabricating solder bumps by wave soldering | Warren M. Farnworth | 2002-04-16 |
| 6337122 | Stereolithographically marked semiconductors devices and methods | James M. Ocker, Rick A. Leininger | 2002-01-08 |