Issued Patents All Time
Showing 101–125 of 202 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8872196 | Chip package | Po-Han Lee | 2014-10-28 |
| 8867832 | Method for detecting and removing scrolling texts during video communication | Shih-Chang Hsia | 2014-10-21 |
| 8823179 | Electronic device package and method for fabricating the same | Chia-Lun Tsai, Wen-Cheng Chien, Po-Han Lee, Wei-Ming Chen, Ying-Nan Wen | 2014-09-02 |
| 8809933 | Bit line structure, semiconductor device and method of forming the same | Guan-De Lee, Shou-Wei Huang, Ying-Tso Chen | 2014-08-19 |
| 8789754 | Electronic device and protection mechanism thereof | Yi-Yuan Chiu, Yu-Tsung Chen, Shu-Hua Chiang | 2014-07-29 |
| 8791768 | Capacitive coupler packaging structure | Ho-Yin Yiu, Ying-Nan Wen, Shih-Yi LEE, Wei-Chung Yang, Bai-Yao Lou +1 more | 2014-07-29 |
| 8778798 | Electronic device package and fabrication method thereof | Shu-Ming Chang, Bai-Yao Lou, Ying-Nan Wen | 2014-07-15 |
| 8772919 | Image sensor package with trench insulator and fabrication method thereof | Wen-Cheng Chien, Wen-Ken Huang, Joey Lai | 2014-07-08 |
| 8748949 | Chip package with heavily doped region and fabrication method thereof | Cheng-Te Chou | 2014-06-10 |
| 8723485 | Power supply system | — | 2014-05-13 |
| 8722463 | Chip package and fabrication method thereof | — | 2014-05-13 |
| 8724062 | Common repair structures for close bus in a liquid crystal display | — | 2014-05-13 |
| 8710680 | Electronic device package and fabrication method thereof | Shu-Ming Chang, Bai-Yao Lou, Ying-Nan Wen | 2014-04-29 |
| 8713227 | Accessing device via communication protocol selection | — | 2014-04-29 |
| 8692284 | Interposer and manufacturing method thereof | Ying-Nan Wen, Wei-Chung Yang | 2014-04-08 |
| 8643070 | Chip package and method for forming the same | Shu-Ming Chang, Chien-Hui Chen, Yen-Shih Ho, Ho-Yin Yiu, Ying-Nan Wen | 2014-02-04 |
| 8624351 | Package structure and method for making the same | Shu-Ming Chang | 2014-01-07 |
| 8614488 | Chip package and method for forming the same | Ying-Nan Wen, Ho-Yin Yiu, Yen-Shih Ho, Shu-Ming Chang, Shih-Yi LEE +1 more | 2013-12-24 |
| 8610200 | Nitride read only memory device with buried diffusion spacers and method for making the same | — | 2013-12-17 |
| 8575791 | Manufacturing-process equipment | Wen-Yuh Jywe, Jing-Chung Shen, Chin-Tien Yang, Jau-Jiu Ju, Chia-Hung Wu +3 more | 2013-11-05 |
| 8508606 | System and method for deblurring motion blurred images | — | 2013-08-13 |
| 8502380 | Chip package and fabrication method thereof | — | 2013-08-06 |
| 8497534 | Chip package with heavily doped regions and fabrication method thereof | Cheng-Te Chou | 2013-07-30 |
| 8476738 | Electronic package with stacked semiconductor chips | — | 2013-07-02 |
| 8466376 | Enclosure of electronic device | PO-CHUAN HSIEH, YU-CHANG PAI | 2013-06-18 |