Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6893962 | Low via resistance system | Zhihai Wang, Weidan Li | 2005-05-17 |
| 6828653 | Method of forming metal fuses in CMOS processes with copper interconnect | Ruggero Castagnetti, Ramnath Venkatraman | 2004-12-07 |
| 6664141 | Method of forming metal fuses in CMOS processes with copper interconnect | Ruggero Castagnetti, Ramnath Venkatraman | 2003-12-16 |
| 6569751 | Low via resistance system | Zhihai Wang, Weidan Li | 2003-05-27 |
| 6109775 | Method for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereon | Keith K. Chao, Ratan K. Choudhury, Gauri C. Das, Nicholas K. Eib, Ashok K. Kapoor +1 more | 2000-08-29 |
| 5776831 | Method of forming a high electromigration resistant metallization system | Gobi R. Padmanabhan | 1998-07-07 |
| 5654897 | Method and structure for improving patterning design for processing | Bruce Whitefield, Chi-Hung Wang | 1997-08-05 |
| 5477466 | Method and structure for improving patterning design for processing | Bruce Whitefield, Chi-Hung Wang | 1995-12-19 |
| 5379233 | Method and structure for improving patterning design for processing | Bruce Whitefield, Chi-Hung Wang | 1995-01-03 |