Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6303995 | Sidewall structure for metal interconnect and method of making same | Ashok K. Kapoor | 2001-10-16 |
| 6109775 | Method for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereon | Prabhakar P. Tripathi, Keith K. Chao, Gauri C. Das, Nicholas K. Eib, Ashok K. Kapoor +1 more | 2000-08-29 |
| 5789783 | Multilevel metallization structure for integrated circuit I/O lines for increased current capacity and ESD protection | Ashok K. Kapoor, Satish R. Menon | 1998-08-04 |
| 5681779 | Method of doping metal layers for electromigration resistance | Nicholas F. Pasch | 1997-10-28 |
| 5614437 | Method for fabricating reliable metallization with Ta-Si-N barrier for semiconductors | — | 1997-03-25 |
| 5525837 | Reliable metallization with barrier for semiconductors | — | 1996-06-11 |
| 5497076 | Determination of failure criteria based upon grain boundary electromigration in metal alloy films | Arthur T. C. Kuo | 1996-03-05 |