Issued Patents All Time
Showing 551–561 of 561 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8971419 | Method and apparatus for encoding/decoding image information | Seungwook Park, Yongjoon Jeon, Chulkeun Kim, Jungsun Kim, Naeri Park +3 more | 2015-03-03 |
| 8937371 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | SinJae Lee, JinGwan Kim, JiHoon Oh, KyuWon Lee | 2015-01-20 |
| 8902978 | Enhanced intra prediction mode signaling | Jungsun Kim, Seungwook Park, Jaewon Sung, Byeongmoon Jeon, Joonyoung Park +2 more | 2014-12-02 |
| 8861594 | Method and apparatus for processing video data | Jungsun Kim, Seungwook Park, Joonyoung Park, Younghee Choi, Jaewon Sung +2 more | 2014-10-14 |
| 8798146 | Planar prediction mode | Byeongmoon Jeon, Seungwook Park, Jaewon Sung, Jungsun Kim, Yongjoon Jeon +2 more | 2014-08-05 |
| 8531012 | Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV | SinJae Lee, JinGwan Kim, JiHoon Oh, KyuWon Lee | 2013-09-10 |
| 8004093 | Integrated circuit package stacking system | JiHoon Oh, JinGwan Kim, SunYoung Chun, KyuWon Lee, SinJae Lee +1 more | 2011-08-23 |
| 7683469 | Package-on-package system with heat spreader | JiHoon Oh, KyuWon Lee, JongVin Park, SinJae Lee | 2010-03-23 |
| 7482203 | Stacked integrated circuit package-in-package system | Sungmin Song, Choong Bin Yim, Seongmin Lee, JoungIn Yang, DongSam Park | 2009-01-27 |
| 7312519 | Stacked integrated circuit package-in-package system | Sungmin Song, Choong Bin Yim, Seongmin Lee, JoungIn Yang, DongSam Park | 2007-12-25 |
| 7298037 | Stacked integrated circuit package-in-package system with recessed spacer | Choong Bin Yim, Sungmin Song, Seongmin Lee, JoungIn Yang, DongSam Park | 2007-11-20 |