Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11126971 | Systems and methods for privacy-preserving enablement of connections within organizations | Michael Bennett Solovay, Benjamin F. Sylvester, III, Ashleigh Ann THOMPSON | 2021-09-21 |
| 10346915 | Systems and methods for hierarchical dual-dynamic exception management | Rajesh L. Tolani, Jeremy M. Dobrick, Frank VAN HOOF, Ciaran Kelly, Kirk Trivett +4 more | 2019-07-09 |
| 7989916 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | Xiang Yin Zeng, Jiangqi He, Ding Hai | 2011-08-02 |
| 7981726 | Copper plating connection for multi-die stack in substrate package | Henry Xu, Jianmin Li, Xiang Yin Zeng | 2011-07-19 |
| 7714432 | Ceramic/organic hybrid substrate | — | 2010-05-11 |
| 7670919 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | Xiang Yin Zeng, Jiangqi He, Ding Hai | 2010-03-02 |
| 7511359 | Dual die package with high-speed interconnect | Xiang Yin Zeng, Jiangqi He | 2009-03-31 |
| 7435664 | Wafer-level bonding for mechanically reinforced ultra-thin die | Daoqiang Lu | 2008-10-14 |
| 7405364 | Decoupled signal-power substrate architecture | Rajendran Nair | 2008-07-29 |
| 7183658 | Low cost microelectronic circuit package | Steven Towle, John Cuendet, Henning Braunisch, Thomas Dory | 2007-02-27 |
| 6888240 | High performance, low cost microelectronic circuit package with interposer | Steven Towle, Gilroy Vandentop | 2005-05-03 |
| 6803649 | Electronic assembly | Jiangqi He, Jung Kang, Dong Zhong, Yuan-Liang Li | 2004-10-12 |