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Open-ended type substrate receiving cassette and system thereof |
— |
2023-10-24 |
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Semiconductor package |
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Control device and method for controlling function thereof |
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Device and method for displaying execution result of application |
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2018-06-12 |
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Method and device for providing a private page |
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2018-05-15 |
| 9639252 |
Device and method for displaying execution result of application |
Young-kyu Jin, Nam-wook Kang, Yong-gook Park, Joo-yoon Bae, Jung-joo Sohn |
2017-05-02 |
| 9607157 |
Method and device for providing a private page |
Jung-joo Sohn, Keum-koo Lee, Young-kyu Jin, Yong-gook Park |
2017-03-28 |
| D779519 |
Display screen or portion thereof with graphical user interface |
Keum-koo Lee, Young-kyu Jin |
2017-02-21 |
| D771665 |
Display screen or portion thereof with graphical user interface |
Keum-koo Lee, Young-kyu Jin |
2016-11-15 |
| D770496 |
Display screen or portion thereof with graphical user interface |
Keum-koo Lee, Young-kyu Jin |
2016-11-01 |
| D769918 |
Display screen or portion thereof with graphical user interface |
Keum-koo Lee, Young-kyu Jin |
2016-10-25 |
| D769277 |
Display screen or portion thereof with graphical user interface |
Keum-koo Lee, Young-kyu Jin |
2016-10-18 |
| 9386706 |
Line width protector printed circuit board and method of manufacturing the same |
Sung-Wook Han, Young Do Kweon, Seung Min BAEK, Young Jae Lee |
2016-07-05 |
| 9320142 |
Electrode structure |
Seung Min BAEK, Jin Hyuck Yang, Chang Bae Lee |
2016-04-19 |
| 9173291 |
Circuit board and method for manufacturing the same |
Sung-Wook Han, Young Do Kweon, Jin Gu Kim, Hyung Jin Jeon |
2015-10-27 |
| 9002580 |
System and method for controlling electrically-powered steering apparatus of vehicle |
Nam Young Kim |
2015-04-07 |
| 8957319 |
Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same |
Sung-Wook Han, Kyoung Moo Harr, Kyung Seob Oh, Kyung Suk Shim, Du Sung Jung |
2015-02-17 |
| 8236690 |
Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad |
Kyoung Ro Yoon, Young-Hwan Shin, Tae-Gon Lee |
2012-08-07 |
| 7768116 |
Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same |
Kyoung Ro Yoon, Young-Hwan Shin, Tae-Gon Lee |
2010-08-03 |
