Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8134196 | Integrated circuit system with metal-insulator-metal circuit element | Yaojian Lin, Haijing Cao, Eng Seng Lim | 2012-03-13 |
| 8008770 | Integrated circuit package system with bump pad | Yaojian Lin, Romeo Emmanuel P. Alvarez, Haijing Cao | 2011-08-30 |
| 7443039 | System for different bond pads in an integrated circuit package | Lun Zhao, Kyaw Oo Aung, Yonggang Jin, Jae Yong SONG, Won Sun Shin | 2008-10-28 |
| 7381634 | Integrated circuit system for bonding | Yaojian Lin, Byung Tai Do, Haijing Cao | 2008-06-03 |
| 7005370 | Method of manufacturing different bond pads on the same substrate of an integrated circuit package | Lun Zhao, Kyaw Oo Aung, Yonggang Jin, Jae Yong SONG, Won Sun Shin | 2006-02-28 |