| 12256542 |
Three-dimensional memory device containing a pillar contact between channel and source and methods of making the same |
Kyohei Nabesaka |
2025-03-18 |
| 12108597 |
Three-dimensional memory device containing a pillar contact between channel and source and methods of making the same |
Shinsuke Yada, Ryo YOSHIMOTO |
2024-10-01 |
| 11889684 |
Three-dimensional memory device with separated source-side lines and method of making the same |
Masanori Tsutsumi, Shinsuke Yada, Mitsuteru Mushiga, Akio Nishida, Hiroyuki Ogawa |
2024-01-30 |
| 11631690 |
Three-dimensional memory device including trench-isolated memory planes and method of making the same |
— |
2023-04-18 |
| 11508711 |
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer |
Takeki Ninomiya |
2022-11-22 |
| 11450624 |
Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same |
Noriaki Oda |
2022-09-20 |
| 11444039 |
Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same |
Noriaki Oda |
2022-09-13 |
| 11393836 |
Three-dimensional memory device with separated source-side lines and method of making the same |
Masanori Tsutsumi, Shinsuke Yada, Mitsuteru Mushiga, Akio Nishida, Hiroyuki Ogawa |
2022-07-19 |
| 11322466 |
Semiconductor die containing dummy metallic pads and methods of forming the same |
— |
2022-05-03 |
| 11201107 |
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer |
Akio Nishida, James Kai |
2021-12-14 |
| 11195781 |
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer |
Akio Nishida, James Kai |
2021-12-07 |
| 11094704 |
Method of forming a three-dimensional memory device and a driver circuit on opposite sides of a substrate |
Yanli Zhang, Johann Alsmeier |
2021-08-17 |
| 11088076 |
Bonding pads embedded in a dielectric diffusion barrier and having recessed metallic liners |
— |
2021-08-10 |