Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475733 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2019-11-12 |
| 10396114 | Method of fabricating low CTE interposer without TSV structure | Charles G. Woychik, Cyprian Emeka Uzoh, Michael Newman | 2019-08-27 |
| 10297582 | BVA interposer | Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Pezhman Monadgemi +3 more | 2019-05-21 |
| 10181411 | Method for fabricating a carrier-less silicon interposer | Michael Newman, Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi | 2019-01-15 |
| 10103094 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2018-10-16 |
| 9893030 | Reliable device assembly | Cyprian Emeka Uzoh, Belgacem Haba, Charles G. Woychik, Michael Newman | 2018-02-13 |
| 9876002 | Microelectronic package with stacked microelectronic units and method for manufacture thereof | Ilyas Mohammed | 2018-01-23 |
| 9685401 | Structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2017-06-20 |
| 9615456 | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Reynaldo Co, Ellis Chau | 2017-04-04 |
| 9601398 | Thin wafer handling and known good die test method | Charles G. Woychik, Se Young Yang, Pezhman Monadgemi, Cyprian Emeka Uzoh | 2017-03-21 |
| 9583475 | Microelectronic package with stacked microelectronic units and method for manufacture thereof | Ilyas Mohammed | 2017-02-28 |
| 9558964 | Method of fabricating low CTE interposer without TSV structure | Charles G. Woychik, Cyprian Emeka Uzoh, Michael Newman | 2017-01-31 |
| 9502390 | BVA interposer | Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Pezhman Monadgemi +3 more | 2016-11-22 |
| 9433100 | Low-stress TSV design using conductive particles | Charles G. Woychik, Kishor Desai, Ilyas Mohammed | 2016-08-30 |
| 9398700 | Method of forming a reliable microelectronic assembly | Cyprian Emeka Uzoh, Belgacem Haba, Charles G. Woychik, Michael Newman | 2016-07-19 |
| 9379008 | Metal PVD-free conducting structures | Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Pezhman Monadgemi | 2016-06-28 |
| 9355905 | Methods and structure for carrier-less thin wafer handling | Cyprian Emeka Uzoh, Pezhman Monadgemi, Michael Newman, Charles G. Woychik | 2016-05-31 |
| 9349669 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2016-05-24 |
| 9237648 | Carrier-less silicon interposer | Michael Newman, Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi | 2016-01-12 |
| 9165911 | Microelectronic package with stacked microelectronic units and method for manufacture thereof | Ilyas Mohammed | 2015-10-20 |
| 9123780 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2015-09-01 |
| 9095074 | Structure for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Reynaldo Co, Ellis Chau | 2015-07-28 |
| 9064933 | Methods and structure for carrier-less thin wafer handling | Cyprian Emeka Uzoh, Pezhman Monadgemi, Michael Newman, Charles G. Woychik | 2015-06-23 |
| 9000600 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2015-04-07 |
| 8981564 | Metal PVD-free conducting structures | Charles G. Woychik, Cyprian Emeka Uzoh, Michael Newman, Pezhman Monadgemi | 2015-03-17 |