| D1036337 |
Front door lining for an automobile |
Fumi Jo |
2024-07-23 |
| D1036336 |
Instrument panel for an automobile |
— |
2024-07-23 |
| 11173535 |
Drilling jig and drilling method using this drilling jig |
Shoji Yokoyama, Tomohiro Ogawa, Kazuya Takita, Ichiro Hosoya, Yukio Kimura |
2021-11-16 |
| 10224290 |
Electromagnetically shielded electronic devices and related systems and methods |
Rajendra C. Dias, Yoshishiro Tomita, Mitul Modi, Joshua D. Heppner, Eric J. Li |
2019-03-05 |
| D837118 |
Instrument panel |
Leonard Takada |
2019-01-01 |
| 8969134 |
Laser ablation tape for solder interconnect formation |
Xavier Francois Brun, Sufi Ahmed |
2015-03-03 |
| 7145226 |
Scalable microelectronic package using conductive risers |
— |
2006-12-05 |
| 7138709 |
Microelectronic package array |
— |
2006-11-21 |
| 7132311 |
Encapsulation of a stack of semiconductor dice |
Masayuki Akiba, Kinya Ichikawa, Jiro Kubota |
2006-11-07 |
| 7132739 |
Encapsulated stack of dice and support therefor |
Masayuki Akiba, Kinya Ichikawa, Jiro Kubota |
2006-11-07 |
| 7071572 |
Pre-back-grind and underfill layer for bumped wafers and dies |
— |
2006-07-04 |
| 6838313 |
Molded flip chip package |
Kinya Ichikawa |
2005-01-04 |
| 6794751 |
Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies |
— |
2004-09-21 |
| 6632704 |
Molded flip chip package |
Kinya Ichikawa |
2003-10-14 |
