Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406911 | Semiconductor device with embedded battery and method therefor | Chanon Suwankasab, Chayathorn Saklang, Crispulo Estira Lictao, JR., Amornthep Saiyajitara, Dominic (PohMeng) Koey | 2025-09-02 |
| 12012328 | Stress isolated device package and method of manufacture | Chad S. Dawson, Mark E. Schlarmann, Colin Bryant Stevens | 2024-06-18 |
| 11823968 | Semiconductor device package having stress isolation and method therefor | Michael B. Vincent, Scott M. Hayes | 2023-11-21 |
| 11760623 | No-gel pressure sensor package | Mark E. Schlarmann, Michael B. Vincent, Scott M. Hayes, Julien Juéry | 2023-09-19 |
| 11498829 | No-gel pressure sensor package | Mark E. Schlarmann, Michael B. Vincent, Scott M. Hayes, Julien Juéry | 2022-11-15 |
| 11482478 | Shielded electronic package and method of fabrication | Crispulo Estira Lictao, JR., Chayathorn Saklang, Amornthep Saiyajitara, Chanon Suwankasab, Bernd Offermann | 2022-10-25 |
| 11335652 | Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong | 2022-05-17 |
| 11127645 | Grounding lids in integrated circuit devices | Dwight L. Daniels, Michael B. Vincent | 2021-09-21 |
| 11031681 | Package integrated waveguide | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Pascal Oberndorff, Walter Parmon | 2021-06-08 |
| 10892229 | Media shield with EMI capability for pressure sensor | Dwight L. Daniels, Thomas Cobb Speight, Gary Carl Johnson | 2021-01-12 |
| 10790220 | Press-fit semiconductor device | Chayathorn Saklang, Chanon Suwankasab, Amornthep Saiyajitara, Bernd Offermann, James Lee Grothe +1 more | 2020-09-29 |
| 10658303 | High aspect ratio connection for EMI shielding | Michael B. Vincent, Dwight L. Daniels | 2020-05-19 |
| 10442685 | Microelectronic packages having hermetic cavities and methods for the production thereof | Philip H. Bowles | 2019-10-15 |
| 10340211 | Sensor module with blade insert | Chanon Suwankasab, Amornthep Saiyajitara, Chayathorn Saklang | 2019-07-02 |
| 10107779 | Sensing field effect transistor devices, systems in which they are incorporated, and methods of their fabrication | Raymond M. Roop, Jose Fernandez Villasenor, Patrice M. Parris | 2018-10-23 |
| 10053359 | Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof | Philip H. Bowles | 2018-08-21 |
| 9927392 | Sensing field effect transistor devices, systems in which they are incorporated, and methods of their fabrication | Raymond M. Roop, Jose Fernandez Villasenor, Patrice M. Parris | 2018-03-27 |
| 9891244 | Microelectronic packages having split gyroscope structures and methods for the fabrication thereof | Philip H. Bowles | 2018-02-13 |
| 9818656 | Devices and methods for testing integrated circuit devices | Mark E. Schlarmann, Dwight L. Daniels, Chad S. Dawson, Fengyuan Li | 2017-11-14 |
| 9790089 | MEMS sensor with side port and method of fabricating same | Chad S. Dawson, Fengyuan Li, Arvind S. Salian | 2017-10-17 |
| 9676611 | Sensor device packages and related fabrication methods | Philip H. Bowles | 2017-06-13 |
| 9663350 | Stress isolated differential pressure sensor | Chad S. Dawson | 2017-05-30 |
| 9638597 | Differential pressure sensor assembly | Darrel R. Frear, Thomas Cobb Speight | 2017-05-02 |
| 9604844 | Sequential wafer bonding | Philip H. Bowles | 2017-03-28 |
| 9598280 | Environmental sensor structure | Akhilesh Kumar Singh, Dwight L. Daniels, Darrel R. Frear | 2017-03-21 |