| 12406911 |
Semiconductor device with embedded battery and method therefor |
Stephen R. Hooper, Chanon Suwankasab, Chayathorn Saklang, Crispulo Estira Lictao, JR., Dominic (PohMeng) Koey |
2025-09-02 |
| 12125771 |
Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof |
Chayathorn Saklang, Chanon Suwankasab, Verapath Vareesantichai |
2024-10-22 |
| 11637024 |
Method for glob top encapsulation using molding tape with elevated sidewall |
Wiwat Tanwongwan, Nathapop Lappanitpullpol |
2023-04-25 |
| 11482478 |
Shielded electronic package and method of fabrication |
Crispulo Estira Lictao, JR., Chayathorn Saklang, Chanon Suwankasab, Stephen R. Hooper, Bernd Offermann |
2022-10-25 |
| 11114239 |
Electronic device, device package, and method of fabrication |
Chayathorn Saklang, Wiwat Tanwongwan, Chanon Suwankasab |
2021-09-07 |
| 11049817 |
Semiconductor device with integral EMI shield |
Chayathorn Saklang, Chanon Suwankasab, Russell J. Lynch |
2021-06-29 |
| 10847385 |
Glob top encapsulation using molding tape |
Wiwat Tanwongwan, Nathapop Lappanitpullpol |
2020-11-24 |
| 10790220 |
Press-fit semiconductor device |
Chayathorn Saklang, Stephen R. Hooper, Chanon Suwankasab, Bernd Offermann, James Lee Grothe +1 more |
2020-09-29 |
| 10763203 |
Conductive trace design for smart card |
Wiwat Tanwongwan, Nathapop Lappanitpullpol |
2020-09-01 |
| 10340211 |
Sensor module with blade insert |
Chanon Suwankasab, Chayathorn Saklang, Stephen R. Hooper |
2019-07-02 |
| 10249556 |
Lead frame with partially-etched connecting bar |
Verapath Vareesantichai, Pimpa Boonyatee, Adrianus Buijsman |
2019-04-02 |
| 9721877 |
Method of mounting passive electronic component on lead frame |
Chanon Suwankasab, Surachai Tangsiriratchatakun, Chayathorn Saklang |
2017-08-01 |