Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125771 | Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof | Chayathorn Saklang, Chanon Suwankasab, Amornthep Saiyajitara | 2024-10-22 |
| 10249556 | Lead frame with partially-etched connecting bar | Amornthep Saiyajitara, Pimpa Boonyatee, Adrianus Buijsman | 2019-04-02 |