Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406911 | Semiconductor device with embedded battery and method therefor | Stephen R. Hooper, Chayathorn Saklang, Crispulo Estira Lictao, JR., Amornthep Saiyajitara, Dominic (PohMeng) Koey | 2025-09-02 |
| 12125771 | Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof | Chayathorn Saklang, Amornthep Saiyajitara, Verapath Vareesantichai | 2024-10-22 |
| 11482478 | Shielded electronic package and method of fabrication | Crispulo Estira Lictao, JR., Chayathorn Saklang, Amornthep Saiyajitara, Stephen R. Hooper, Bernd Offermann | 2022-10-25 |
| 11114239 | Electronic device, device package, and method of fabrication | Chayathorn Saklang, Wiwat Tanwongwan, Amornthep Saiyajitara | 2021-09-07 |
| 11049817 | Semiconductor device with integral EMI shield | Chayathorn Saklang, Amornthep Saiyajitara, Russell J. Lynch | 2021-06-29 |
| 10790220 | Press-fit semiconductor device | Chayathorn Saklang, Stephen R. Hooper, Amornthep Saiyajitara, Bernd Offermann, James Lee Grothe +1 more | 2020-09-29 |
| 10340211 | Sensor module with blade insert | Amornthep Saiyajitara, Chayathorn Saklang, Stephen R. Hooper | 2019-07-02 |
| 9721877 | Method of mounting passive electronic component on lead frame | Amornthep Saiyajitara, Surachai Tangsiriratchatakun, Chayathorn Saklang | 2017-08-01 |
| 9257374 | Thin shrink outline package (TSOP) | Amornthep Saiyajiatara | 2016-02-09 |