Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637024 | Method for glob top encapsulation using molding tape with elevated sidewall | Wiwat Tanwongwan, Amornthep Saiyajitara | 2023-04-25 |
| 10847385 | Glob top encapsulation using molding tape | Wiwat Tanwongwan, Amornthep Saiyajitara | 2020-11-24 |
| 10763203 | Conductive trace design for smart card | Amornthep Saiyajitara, Wiwat Tanwongwan | 2020-09-01 |