Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10516092 | Interface substrate and method of making the same | Jon Aday, Hong Bok We, Nicholas Ian Buchan | 2019-12-24 |
| 9318405 | Wafer level package without sidewall cracking | Jianwen Xu, Lizabeth Keser, William Stone, Nicholas Yu | 2016-04-19 |
| 9209110 | Integrated device comprising wires as vias in an encapsulation layer | Reynante Tamunan Alvarado, Lizabeth Keser | 2015-12-08 |
| 9171782 | Stacked redistribution layers on die | Christine Hau-Riege, You-Wen Yau, Kevin Patrick Caffey, Lizabeth Keser, Gene H. McAllister +2 more | 2015-10-27 |
| 5441195 | Method of stretching solder joints | Jerry Ihor Tustaniwskyj, Maria Del Carmen Alvarez, Robert E. Rackerby, Patrick A. Weber | 1995-08-15 |
| 4845542 | Interconnect for layered integrated circuit assembly | Tushar R. Gheewala, Stephen A. Campbell, Robert J. Baseman | 1989-07-04 |