Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11449310 | Random number generator, encryption/decryption secret key generator and method based on characteristics of memory cells | Cheng-Yu Chen, Yi-Lin Hsieh, Jing Xiao | 2022-09-20 |
| 11055023 | Electronic device, related controller circuit and method | Yi-Lin Hsieh, Cheng-Yu Chen | 2021-07-06 |
| 10956087 | Memory controller having temperature dependent data program scheme and related method | Cheng-Yu Chen | 2021-03-23 |
| 10705743 | Memory control device, control method of flash memory, and method for generating security feature of flash memory | Cheng-Yu Chen, Yi-Lin Hsieh, Jing Xiao | 2020-07-07 |
| 10672499 | NAND flash memory controller and storage apparatus applying the same | Shu-Min Lin, Jo-Hua Wu, Cheng-Yu Chen | 2020-06-02 |
| 10288258 | Lighting module | Wei-Jung Lee | 2019-05-14 |
| 9564346 | Package carrier, semiconductor package, and process for fabricating same | Yuan-Chang Su, Chia-Cheng Chen | 2017-02-07 |
| 9548138 | Test method for memory | Ying-Tsai Ting, Che-Chin Wu, Tsung-Yi Chou | 2017-01-17 |
| 9406658 | Embedded component device and manufacturing methods thereof | Chun-Che Lee, Yuan-Chang Su, Ming-Chiang Lee | 2016-08-02 |
| 9305638 | Operation method for memory device | Yu-Ming Chang, Yung-Chun Li, Chih-Chang Hsieh, Hsiang-Pang Li, Yuan-Hao Chang +1 more | 2016-04-05 |
| 9196597 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more | 2015-11-24 |
| 9165900 | Semiconductor package and process for fabricating same | Yuan-Chang Su, Chia-Cheng Chen, Chia-Hsiung Hsieh, Tzu-Hui Chen, Kuang-Hsiung Chen +1 more | 2015-10-20 |
| 8945994 | Single layer coreless substrate | Dror Hurwitz | 2015-02-03 |
| 8884424 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more | 2014-11-11 |
| 8866286 | Single layer coreless substrate | Dror Hurwitz, Xianming Chen Simon Chan | 2014-10-21 |
| 8786062 | Semiconductor package and process for fabricating same | Yuan-Chang Su, Chia-Cheng Chen, Chia-Hsiung Hsieh, Tzu-Hui Chen, Kuang-Hsiung Chen +1 more | 2014-07-22 |
| 8569894 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Chia-Cheng Chen, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more | 2013-10-29 |
| 8399776 | Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package | Bernd Karl Appelt, William T. Chen, Calvin Chun Long CHEUNG, Yuan-Chang Su, Chia-Cheng Chen +1 more | 2013-03-19 |
| 8367473 | Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof | Yuan-Chang Su, Chia-Cheng Chen, Ta-Chun Lee, Kuang-Hsiung Chen | 2013-02-05 |
| 8357861 | Circuit board, and chip package structure | Yuan-Chang Su, Chia-Hsiung Hsieh | 2013-01-22 |
| 8330267 | Semiconductor package | Kuang-Hsiung Chen, Pao-Ming Hsieh, Yuan-Chang Su, Bernd Karl Appelt | 2012-12-11 |
| 8320134 | Embedded component substrate and manufacturing methods thereof | Yuan-Chang Su, Ming-Chiang Lee, Chien-Hao Wang | 2012-11-27 |
| 8288869 | Semiconductor package with substrate having single metal layer and manufacturing methods thereof | Yuan-Chang Su, Chia-Cheng Chen, Kuang-Hsiung Chen, Ming-Chiang Lee, Bernd Karl Appelt +1 more | 2012-10-16 |
| 8284561 | Embedded component package structure | Yuan-Chang Su, Bernd Karl Appelt, Ming-Chiang Lee | 2012-10-09 |