Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12401111 | Antenna | Makoto Kimura, Yukinobu Tarui, Takumi NAGAMINE | 2025-08-26 |
| 9023717 | Method for manufacturing semiconductor device | Kazuyuki Nakagawa | 2015-05-05 |
| 8494427 | Fixing device, image forming apparatus, and fixing method | Kazuya Nagao, Takuma Nakamura, Yuichi Aoyama, Masafumi Yamada, Tetsurou Sasamoto +1 more | 2013-07-23 |
| 8472852 | Fixing device and image forming apparatus | Yuichi Aoyama, Takuma Nakamura, Tetsurou Sasamoto, Masafumi Yamada | 2013-06-25 |
| 8428503 | Fixing device and image forming apparatus | Tetsurou Sasamoto, Takuma Nakamura, Masafumi Yamada, Yuichi Aoyama, Takanori Inadome +1 more | 2013-04-23 |
| 8170457 | Fixing device and image forming apparatus | Yuichi Aoyama, Yasuo Katano, Yukimichi Someya, Takuma Nakamura, Tetsurou Sasamoto +1 more | 2012-05-01 |
| 7028397 | Method of attaching a semiconductor chip to a chip mounting substrate | Tetsuya Uebayashi, Naoki Izumi, Akira Yamazaki | 2006-04-18 |
| 6995468 | Semiconductor apparatus utilizing a preparatory stage for a chip assembly | Tetsuya Uebayashi, Naoki Izumi, Akira Yamazaki | 2006-02-07 |
| 6965154 | Semiconductor device | Tetsuya Uebayashi, Naoki Izumi, Akira Yamazaki | 2005-11-15 |
| 6867507 | Lead frame | Tetsuya Uebayashi, Naoki Izumi, Akira Yamazaki | 2005-03-15 |
| 6784021 | Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus | Tetsuya Uebayashi, Naoki Izumi, Akira Yamazaki | 2004-08-31 |
| 6737736 | Semiconductor device | Tetsuya Uebayashi, Naoki Izumi, Akira Yamazaki | 2004-05-18 |
| 6559590 | Paint for heat absorbing film, heat absorbing film and color CRT | Masatoshi Mori, Akihiko Yoshida, Kimiyo Ibaraki, Hitoshi Kimata, Yasunori Metsugi +1 more | 2003-05-06 |
| 6192146 | Image processing system | — | 2001-02-20 |
| 5900582 | Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame | Yoshihiro Tomita, Naoto Ueda, Yoshirou Nishinaka, Hideyuki Ichiyama | 1999-05-04 |
| 5805314 | Color image forming apparatus separately correcting each color component image | Mitsuo Hasebe | 1998-09-08 |
| 5763829 | Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe | Yoshihiro Tomita, Naoto Ueda, Yoshirou Nishinaka, Hideyuki Ichiyama | 1998-06-09 |
| 5724726 | Method of making leadframe for lead-on-chip (LOC) semiconductor device | Yoshihiro Tomita, Naoto Ueda, Yoshirou Nishinaka, Hideyuki Ichiyama | 1998-03-10 |
| 5668404 | Semiconductor device and production method thereof | Seizo Ohmae | 1997-09-16 |
| 5659199 | Resin sealed semiconductor device | Ryuichiro Mori, Tatsuhiko Akiyama, Michitaka Kimura | 1997-08-19 |
| 5609287 | Solder material, junctioning method, junction material, and semiconductor device | Goro Izuta, Yoshirou Nishinaka, Katsuyuki Fukutome, Naoto Ueda, Toshio Takeuchi +2 more | 1997-03-11 |
| 5535509 | Method of making a lead on chip (LOC) semiconductor device | Yoshihiro Tomita, Naoto Ueda, Yoshirou Nishinaka, Hideyuki Ichiyama | 1996-07-16 |
| 5508811 | Image reading and recording apparatus with correct image mode and mirror image mode | Masaharu Ohkubo, Akio Suzuki, Yoshihiro Takada | 1996-04-16 |
| 5471325 | Storing coded color components of coded input image and coded image data received from a transmission line | — | 1995-11-28 |
| 5440169 | Resin-packaged semiconductor device with flow prevention dimples | Yoshihiro Tomita | 1995-08-08 |