Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11700696 | Buried electrical debug access port | Florence R. Neumann, Bilal Khalaf | 2023-07-11 |
| 11064612 | Buried electrical debug access port | Florence R. Pon, Bilal Khalaf | 2021-07-13 |
| 10847450 | Compact wirebonding in stacked-chip system in package, and methods of making same | Hyoung Il Kim, Bilal Khalaf, Min-Tih Lai | 2020-11-24 |
| 10204884 | Multichip packaging for dice of different sizes | — | 2019-02-12 |
| 10090261 | Microelectronic package debug access ports and methods of fabricating the same | Florence R. Pon, Bilal Khalaf | 2018-10-02 |
| 9936582 | Integrated circuit assemblies with molding compound | Junfeng Zhao, Cheng Yang | 2018-04-03 |
| 9773764 | Solid state device miniaturization | Mark Melone | 2017-09-26 |
| 9646952 | Microelectronic package debug access ports | Florence R. Pon, Bilal Khalaf | 2017-05-09 |
| 7372133 | Microelectronic package having a stiffening element and method of making same | Brian Taggart, Dale Hackitt | 2008-05-13 |
| 7141452 | Methods of reducing bleed-out of underfill and adhesive materials | Mahesh Sambasivam, Drew W. Delaney | 2006-11-28 |