Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237219 | Contact with bronze material to mitigate undercut | Nazila Dadvand, Christopher Daniel Manack | 2025-02-25 |
| 12100678 | Conductive members for die attach in flip chip packages | Christopher Daniel Manack, Maricel Fabia Escaño, Rafael Jose Lizares Guevara | 2024-09-24 |
| 12074096 | Die attach surface copper layer with protective layer for microelectronic devices | Christopher Daniel Manack, Nazila Dadvand | 2024-08-27 |
| 12068221 | Plating for thermal management | Nazila Dadvand, Christopher Daniel Manack | 2024-08-20 |
| 11984418 | Method of forming brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Patrick Francis Thompson | 2024-05-14 |
| 11948871 | Process for thin film capacitor integration | Benjamin Stassen Cook, Yogesh Kumar Ramadass, Mahmud Halim Chowdhury | 2024-04-02 |
| 11876065 | Flip chip package assembly | Katleen Fajardo Timbol, Rafael Jose Lizares Guevara | 2024-01-16 |
| 11855024 | Wafer chip scale packages with visible solder fillets | Qiao Chen, Vivek Swaminathan Sridharan, Christopher Daniel Manack, Patrick Francis Thompson, Jonathan Andrew Montoya | 2023-12-26 |
| 11594504 | Nickel alloy for semiconductor packaging | Nazila Dadvand, Christopher Daniel Manack | 2023-02-28 |
| 11587858 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Christopher Daniel Manack | 2023-02-21 |
| 11443996 | Zinc layer for a semiconductor die pillar | Nazila Dadvand, Keith Edward Johnson, Christopher Daniel Manack | 2022-09-13 |
| 11410947 | Brass-coated metals in flip-chip redistribution layers | Vivek Swaminathan Sridharan, Christopher Daniel Manack, Nazila Dadvand, Patrick Francis Thompson | 2022-08-09 |
| 11362020 | Flipchip package with an IC having a covered cavity comprising metal posts | Christopher Daniel Manack, Jonathan Andrew Montoya, Jovenic Romero Esquejo | 2022-06-14 |
| 11127515 | Nanostructure barrier for copper wire bonding | Nazila Dadvand, Christopher Daniel Manack | 2021-09-21 |
| 11011488 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Christopher Daniel Manack | 2021-05-18 |
| 11011483 | Nickel alloy for semiconductor packaging | Nazila Dadvand, Christopher Daniel Manack | 2021-05-18 |
| 10796956 | Contact fabrication to mitigate undercut | Nazila Dadvand, Christopher Daniel Manack | 2020-10-06 |
| 10734304 | Plating for thermal management | Nazila Dadvand, Christopher Daniel Manack | 2020-08-04 |
| 10692830 | Multilayers of nickel alloys as diffusion barrier layers | Nazila Dadvand, Christopher Daniel Manack | 2020-06-23 |
| 10629334 | Nanostructure barrier for copper wire bonding | Nazila Dadvand, Christopher Daniel Manack | 2020-04-21 |
| 10566267 | Die attach surface copper layer with protective layer for microelectronic devices | Christopher Daniel Manack, Nazila Dadvand | 2020-02-18 |
| 10453817 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Christopher Daniel Manack | 2019-10-22 |
| 10424552 | Alloy diffusion barrier layer | Nazila Dadvand, Christopher Daniel Manack | 2019-09-24 |
| 8470614 | PECVD showerhead configuration for CMP uniformity and improved stress | Jason New | 2013-06-25 |
| 7573086 | TaN integrated circuit (IC) capacitor | Michael Huber, Gregory Lee Hendy, Evelyn Lafferty, George Harakas, Blake Ryan Pasker +2 more | 2009-08-11 |