Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12048964 | Bonding material and bonding method using same | Keiichi Endoh, Minami Kanasugi, Hideyuki Fujimoto | 2024-07-30 |
| 11453053 | Joining material and joining method using same | Tatsuro Hori, Keiichi Endoh, Hiromasa Miyoshi | 2022-09-27 |
| 10903185 | Bonding material and bonding method using same | Keiichi Endoh, Koichi Yuzaki, Minami Nagaoka, Hiromasa Miyoshi | 2021-01-26 |
| 10821558 | Bonding material and bonding method using same | Keiichi Endoh, Hiromasa Miyoshi, Kimikazu Motomura | 2020-11-03 |
| 10543569 | Bonding material and bonding method using same | Takashi Hinotsu, Keiichi Endoh, Hiromasa Miyoshi | 2020-01-28 |
| 10510557 | Electronic part mounting substrate and method for producing same | Naoya Sunachi, Hideyo Osanai | 2019-12-17 |
| 10328534 | Bonding material and bonding method using same | Keiichi Endoh, Minami Nagaoka, Hiromasa Miyoshi, Yoshiko Kohno, Akihiro Miyazawa | 2019-06-25 |
| 9831157 | Method of attaching an electronic part to a copper plate having a surface roughness | Naoya Sunachi, Hideyo Osanai | 2017-11-28 |
| 9662748 | Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method | Keiichi Endoh, Hiromasa Miyoshi, Takashi Hinotsu, Yoshiko Kohno | 2017-05-30 |
| 9533380 | Bonding material and bonding method in which said bonding material is used | Keiichi Endoh, Minami Nagaoka | 2017-01-03 |
| 9486879 | Bonding material and bonding body, and bonding method | Keiichi Endoh, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama | 2016-11-08 |
| 9273235 | Bonding material comprising coated silver nanoparticles and bonded object produced using same | Takashi Hinotsu, Shinya Sasaki | 2016-03-01 |
| 6250087 | Super-quick freezing method and apparatus therefor | Norio Owada | 2001-06-26 |