KY

Koichi Yuzaki

DC Dowa Electronics Materials Co.: 1 patents #148 of 241Top 65%
Overall (All Time): #2,706,843 of 4,157,543Top 70%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10903185 Bonding material and bonding method using same Keiichi Endoh, Minami Nagaoka, Hiromasa Miyoshi, Satoru Kurita 2021-01-26