Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903185 | Bonding material and bonding method using same | Keiichi Endoh, Koichi Yuzaki, Hiromasa Miyoshi, Satoru Kurita | 2021-01-26 |
| 10328534 | Bonding material and bonding method using same | Keiichi Endoh, Satoru Kurita, Hiromasa Miyoshi, Yoshiko Kohno, Akihiro Miyazawa | 2019-06-25 |
| 9533380 | Bonding material and bonding method in which said bonding material is used | Keiichi Endoh, Satoru Kurita | 2017-01-03 |