Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11453053 | Joining material and joining method using same | Satoru Kurita, Tatsuro Hori, Keiichi Endoh | 2022-09-27 |
| 10903185 | Bonding material and bonding method using same | Keiichi Endoh, Koichi Yuzaki, Minami Nagaoka, Satoru Kurita | 2021-01-26 |
| 10821558 | Bonding material and bonding method using same | Keiichi Endoh, Kimikazu Motomura, Satoru Kurita | 2020-11-03 |
| 10543569 | Bonding material and bonding method using same | Satoru Kurita, Takashi Hinotsu, Keiichi Endoh | 2020-01-28 |
| 10328534 | Bonding material and bonding method using same | Keiichi Endoh, Minami Nagaoka, Satoru Kurita, Yoshiko Kohno, Akihiro Miyazawa | 2019-06-25 |
| 9914845 | Fine silver particle dispersing solution | Takashi Hinotsu, Tomonori Shibayama | 2018-03-13 |
| 9662748 | Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method | Keiichi Endoh, Takashi Hinotsu, Satoru Kurita, Yoshiko Kohno | 2017-05-30 |
| 8673049 | Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same | Gregory A. Jablonski, Michael A. Mastropietro, Kimitaka Sato, Hidefumi Fujita | 2014-03-18 |
| 7235119 | Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste | Kazushi Sano, Yoshihiro Okada, Yoshiomi Takada | 2007-06-26 |
| 6923924 | Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste | Kazushi Sano, Yoshihiro Okada, Yoshiomi Takada | 2005-08-02 |
| 6881240 | Copper powder for electrically conductive paste | Kazushi Sano, Yoshihiro Okada | 2005-04-19 |
| 6875252 | Copper powder and process for producing copper powder | Kazushi Sano, Yoshihiro Okada, Yoshiomi Takada | 2005-04-05 |
| 6620344 | Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste | Kazushi Sano, Yoshihiro Okada, Yoshiomi Takada | 2003-09-16 |