Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10328534 | Bonding material and bonding method using same | Keiichi Endoh, Minami Nagaoka, Satoru Kurita, Hiromasa Miyoshi, Yoshiko Kohno | 2019-06-25 |
| 10090275 | Bonding method using bonding material | Keiichi Endoh, Yutaka Hisaeda, Aiko Hirata, Toshihiko Ueyama | 2018-10-02 |
| 10008471 | Bonding material and bonding method using the same | Keiichi Endoh, Yutaka Hisaeda, Aiko Hirata, Toshihiko Ueyama | 2018-06-26 |
| 9240256 | Bonding material and bonding method using the same | Keiichi Endoh, Yutaka Hisaeda, Aiko Nagahara, Toshihiko Ueyama | 2016-01-19 |
| 8641929 | Low-temperature-sinterable bonding material, and bonding method using the bonding material | Keiichi Endoh, Yutaka Hisaeda, Aiko Nagahara, Toshihiko Ueyama | 2014-02-04 |