YK

Yoshiko Kohno

DC Dowa Electronics Materials Co.: 2 patents #97 of 241Top 45%
Overall (All Time): #1,940,618 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10328534 Bonding material and bonding method using same Keiichi Endoh, Minami Nagaoka, Satoru Kurita, Hiromasa Miyoshi, Akihiro Miyazawa 2019-06-25
9662748 Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method Keiichi Endoh, Hiromasa Miyoshi, Takashi Hinotsu, Satoru Kurita 2017-05-30