| 12048964 |
Bonding material and bonding method using same |
Keiichi Endoh, Minami Kanasugi, Hideyuki Fujimoto |
2024-07-30 |
| 11453053 |
Joining material and joining method using same |
Tatsuro Hori, Keiichi Endoh, Hiromasa Miyoshi |
2022-09-27 |
| 10903185 |
Bonding material and bonding method using same |
Keiichi Endoh, Koichi Yuzaki, Minami Nagaoka, Hiromasa Miyoshi |
2021-01-26 |
| 10821558 |
Bonding material and bonding method using same |
Keiichi Endoh, Hiromasa Miyoshi, Kimikazu Motomura |
2020-11-03 |
| 10543569 |
Bonding material and bonding method using same |
Takashi Hinotsu, Keiichi Endoh, Hiromasa Miyoshi |
2020-01-28 |
| 10510557 |
Electronic part mounting substrate and method for producing same |
Naoya Sunachi, Hideyo Osanai |
2019-12-17 |
| 10328534 |
Bonding material and bonding method using same |
Keiichi Endoh, Minami Nagaoka, Hiromasa Miyoshi, Yoshiko Kohno, Akihiro Miyazawa |
2019-06-25 |
| 9831157 |
Method of attaching an electronic part to a copper plate having a surface roughness |
Naoya Sunachi, Hideyo Osanai |
2017-11-28 |
| 9662748 |
Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method |
Keiichi Endoh, Hiromasa Miyoshi, Takashi Hinotsu, Yoshiko Kohno |
2017-05-30 |
| 9533380 |
Bonding material and bonding method in which said bonding material is used |
Keiichi Endoh, Minami Nagaoka |
2017-01-03 |
| 9486879 |
Bonding material and bonding body, and bonding method |
Keiichi Endoh, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama |
2016-11-08 |
| 9273235 |
Bonding material comprising coated silver nanoparticles and bonded object produced using same |
Takashi Hinotsu, Shinya Sasaki |
2016-03-01 |
| 6250087 |
Super-quick freezing method and apparatus therefor |
Norio Owada |
2001-06-26 |