Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300512 | Metal/ceramic bonding substrate and method for producing same | Akira Sugawara | 2025-05-13 |
| 12221389 | Aluminum/ceramic bonding substrate and method for producing same | Koji Kobayashi, Takuma Tsubota, Daisuke Oya | 2025-02-11 |
| 12145352 | Metal/ceramic bonding substrate and method for producing same | — | 2024-11-19 |
| 11919288 | Method for producing heat radiation member | Akira Sugawara | 2024-03-05 |
| 11162745 | Heat radiating plate and method for producing same | Satoru Ideguchi, Hirotaka Kotani | 2021-11-02 |
| 10619948 | Heat radiating plate with supporting members and protrusion members | Satoru Ideguchi, Hirotaka Kotani | 2020-04-14 |
| 10510557 | Electronic part mounting substrate and method for producing same | Naoya Sunachi, Satoru Kurita | 2019-12-17 |
| 9944565 | Metal/ceramic bonding substrate and method for producing same | Yukihiro Kitamura, Hiroto Aoki, Yukihiro Kanechika, Ken Sugawara, Yasuko Takeda | 2018-04-17 |
| 9831157 | Method of attaching an electronic part to a copper plate having a surface roughness | Naoya Sunachi, Satoru Kurita | 2017-11-28 |
| 9713253 | Metal/ceramic bonding substrate and method for producing same | Takayuki Takahashi, Satoru Ideguchi, Hirotaka Kotani | 2017-07-18 |
| 9474146 | Manufacturing method of radiator-integrated substrate and radiator-integrated substrate | Hisashi Hori, Takanori Kokubo, Kunihiko Chihara | 2016-10-18 |
| 9320129 | Liquid-cooled integrated substrate and manufacturing method of liquid-cooled integrated substrate | Hisashi Hori, Takanori Kokubo, Takayuki Takahashi, Kunihiko Chihara | 2016-04-19 |
| 8927873 | Fin-integrated substrate and manufacturing method of fin-integrated substrate | Hisashi Hori, Takayuki Takahashi | 2015-01-06 |
| 8745841 | Aluminum bonding member and method for producing same | — | 2014-06-10 |
| 8039757 | Electronic part mounting substrate and method for producing same | — | 2011-10-18 |
| 8011416 | Apparatus, mold, and method for manufacturing metal-ceramic composite member | Susumu Ibaragi, Makoto Namioka | 2011-09-06 |
| 7487585 | Method of manufacturing a metal-ceramic circuit board | Masahiro Furo | 2009-02-10 |
| 7393596 | Aluminum/ceramic bonding substrate and method for producing same | Satoru Ideguchi | 2008-07-01 |
| 7387741 | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof | Ken Iyoda, Makoto Namioka, Susumu Shimada | 2008-06-17 |
| 7368665 | Circuit board and a power module employing the same | Masahiro Hara | 2008-05-06 |
| 7348493 | Metal-ceramic circuit board | Masahiro Furo | 2008-03-25 |
| 7340828 | Method for producing metal/ceramic bonding circuit board | Makoto Namioka, Susumu Ibaraki | 2008-03-11 |
| 7304378 | Aluminum/ceramic bonding substrate | — | 2007-12-04 |
| 7276292 | Insulating substrate boards for semiconductor and power modules | Masahiro Furo | 2007-10-02 |
| 7256353 | Metal/ceramic bonding substrate and method for producing same | Susumu Ibaraki, Ken Iyoda, Makoto Namioka | 2007-08-14 |