HO

Hideyo Osanai

DC Dowa Mining Co.: 18 patents #1 of 324Top 1%
DC Dowa Metaltech Co.: 17 patents #3 of 80Top 4%
NC Nippon Light Metal Company: 3 patents #81 of 499Top 20%
Mitsubishi Electric: 1 patents #15,491 of 25,717Top 65%
TO Tokuyama: 1 patents #280 of 562Top 50%
Overall (All Time): #95,748 of 4,157,543Top 3%
35
Patents All Time

Issued Patents All Time

Showing 26–35 of 35 patents

Patent #TitleCo-InventorsDate
7255931 Aluminum/ceramic bonding substrate and method for producing same Satoru Ideguchi 2007-08-14
7189449 Metal/ceramic bonding substrate and method for producing same Takayuki Takahashi, Makoto Namioka 2007-03-13
7159310 Electronic part mounting substrate and method for producing same 2007-01-09
7131483 Apparatus, mold, and method for manufacturing metal-ceramic composite member Susumu Ibaragi, Makoto Namioka 2006-11-07
7122243 Metal/ceramic bonding substrate and method for producing same Takayuki Takahashi, Makoto Namioka 2006-10-17
7073703 Aluminum/ceramic bonding substrate and method for producing same Takayuki Takahashi, Makoto Namioka 2006-07-11
7008549 Circuit board, process for producing the same and a power module employing the same Masahiro Hara 2006-03-07
6997233 Mold and method for manufacturing metal-ceramic composite member Susumu Ibaragi, Makoto Namioka 2006-02-14
6938333 Method of manufacturing a metal-ceramic circuit board Masahiro Furo 2005-09-06
6912130 Combined member of aluminum-ceramics Makoto Namioka, Ken Iyoda 2005-06-28