Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10821558 | Bonding material and bonding method using same | Keiichi Endoh, Hiromasa Miyoshi, Satoru Kurita | 2020-11-03 |
| 9721694 | Fine silver particle powder, method for manufacturing the same, silver paste using the powder and method of use of the paste | Shuji Kaneda, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha | 2017-08-01 |
| 9034214 | Fine silver particle powder, method for manufacturing the same, silver paste using the powder, and method of use of the paste | Shuji Kaneda, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha | 2015-05-19 |