Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1091491 | Debubbler component | James Isaac Fortner, Chad M. Hosack | 2025-09-02 |
| D1090468 | Debubbler component | James Isaac Fortner, Chad M. Hosack | 2025-08-26 |
| 12281402 | Low angle membrane frame for an electroplating cell | Frederick Dean Wilmot, Nirmal Shankar SIGAMANI, Gabriel Hay Graham | 2025-04-22 |
| 11655556 | Flow assisted dynamic seal for high-convection, continuous-rotation plating | Aaron Berke, Stephen J. Banik, II, Bryan L. Buckalew | 2023-05-23 |
| 11549192 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Bryan L. Buckalew | 2023-01-10 |
| 11001934 | Methods and apparatus for flow isolation and focusing during electroplating | Stephen J. Banik, II, Bryan L. Buckalew, Aaron Berke, James Isaac Fortner, Justin Oberst +1 more | 2021-05-11 |
| 10982346 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Aaron Berke, Steven T. Mayer, Santosh Kumar, Lee Peng Chua | 2021-04-20 |
| 10975489 | One-piece anode for tuning electroplating at an edge of a substrate | James Isaac Fortner | 2021-04-13 |
| 10969036 | High flow multi-way piston valve for deposition systems | James Isaac Fortner, Aaron Berke, Jingbin Feng | 2021-04-06 |
| 10923340 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Steven T. Mayer | 2021-02-16 |
| 10920335 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Bryan L. Buckalew | 2021-02-16 |
| 10781527 | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating | Stephen J. Banik, II, Aaron Berke, Bryan L. Buckalew | 2020-09-22 |
| 10760178 | Method and apparatus for synchronized pressure regulation of separated anode chamber | Stephen J. Banik, II, Bryan L. Buckalew, Frederick Dean Wilmot | 2020-09-01 |
| 10662545 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo +1 more | 2020-05-26 |
| 10612151 | Flow assisted dynamic seal for high-convection, continuous-rotation plating | Aaron Berke, Stephen J. Banik, II, Bryan L. Buckalew | 2020-04-07 |
| 10301738 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Steven T. Mayer, Thomas A. Ponnuswamy, Brian Paul Blackman, Doug Higley | 2019-05-28 |
| 10208395 | Bubble and foam solutions using a completely immersed air-free feedback flow control valve | Richard Abraham, David W. Porter, Steven T. Mayer, John Floyd Ostrowski | 2019-02-19 |
| 10190230 | Cross flow manifold for electroplating apparatus | Richard Abraham, Steven T. Mayer, Bryan L. Buckalew | 2019-01-29 |
| 10092933 | Methods and apparatuses for cleaning electroplating substrate holders | Santosh Kumar, Bryan L. Buckalew, Steven T. Mayer, Thomas A. Ponnuswamy, Chad Michael Hosack +2 more | 2018-10-09 |
| 10094034 | Edge flow element for electroplating apparatus | Gabriel Hay Graham, Bryan L. Buckalew, Steven T. Mayer, James Isaac Fortner, Lee Peng Chua | 2018-10-09 |
| 10087545 | Automated cleaning of wafer plating assembly | Steven T. Mayer, Thomas A. Ponnuswamy, Lee Peng Chua | 2018-10-02 |
| 10066311 | Multi-contact lipseals and associated electroplating methods | John Floyd Ostrowski | 2018-09-04 |
| 10053793 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Aaron Berke, Steven T. Mayer, Santosh Kumar, Lee Peng Chua | 2018-08-21 |
| 10017869 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Bryan L. Buckalew | 2018-07-10 |
| 10014170 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Steven T. Mayer | 2018-07-03 |