Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6693031 | Formation of a metallic interlocking structure | Gerald G. Advocate, Jr., Francis J. Downes, Jr., Luis J. Matienzo, John S. Kresge, Daniel C. Van Hart | 2004-02-17 |
| 6348737 | Metallic interlocking structure | Gerald G. Advocate, Jr., Francis J. Downes, Jr., Luis J. Matienzo, John S. Kresge, Daniel C. Van Hart | 2002-02-19 |
| 5334461 | Product formed by method of controlling resistivity of plated metal | Melanie A. Day, Steven A. Schubert | 1994-08-02 |
| 5189261 | Electrical and/or thermal interconnections and methods for obtaining such | Lawrence C. Alexander, Bernd Karl Appelt, David K. Balkin, James Jens Hansen, Joseph Hromek +5 more | 1993-02-23 |
| 4967690 | Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means | Edmond O. Fey, Peter Haselbauer, Dae Young Jung, Hans-Dieter Kilthau, Roy H. Magnuson +1 more | 1990-11-06 |
| 4904506 | Copper deposition from electroless plating bath | Peter A. Burnett, Dae Young Jung, Roy H. Magnuson, Robert G. Rickert, Stephen L. Tisdale | 1990-02-27 |
| 4756923 | Method of controlling resistivity of plated metal and product formed thereby | Melanie A. Day, Steven A. Schubert | 1988-07-12 |
| 4707377 | Copper plating | Robert J. Capwell, Donald G. McBride, Robert G. Rickert, Donald P. Seraphim | 1987-11-17 |
| 4684545 | Electroless plating with bi-level control of dissolved oxygen | Edmond O. Fey, Peter Haselbauer, Dae Young Jung, Hans-Dieter Kilthau, Roy H. Magnuson +1 more | 1987-08-04 |
| 4623554 | Method for controlling plating rate in an electroless plating system | Roy H. Magnuson, Edward J. Yarmchuk | 1986-11-18 |
| 4554184 | Method for plating from an electroless plating bath | Michael J. Canestaro, Donald G. McBride, Donald P. Seraphim | 1985-11-19 |
| 4552787 | Deposition of a metal from an electroless plating composition | Paul Chebiniak, Lois J. Root | 1985-11-12 |