Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10315918 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Buu Q. Diep, Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy | 2019-06-11 |
| 10262913 | Wafer level package solder barrier used as vacuum getter | Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2019-04-16 |
| 9966320 | Wafer level package solder barrier used as vacuum getter | Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2018-05-08 |
| 9520332 | Wafer level package solder barrier used as vacuum getter | Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2016-12-13 |
| 9427776 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Buu Q. Diep, Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy | 2016-08-30 |
| 9227839 | Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling | Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy, Buu Q. Diep | 2016-01-05 |
| 9196556 | Getter structure and method for forming such structure | Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian, Buu Q. Diep | 2015-11-24 |
| 9187312 | Integrated bondline spacers for wafer level packaged circuit devices | Buu Q. Diep, Thomas A. Kocian, Stephen H. Black, Adam M. Kennedy | 2015-11-17 |
| 9174836 | Integrated bondline spacers for wafer level packaged circuit devices | Buu Q. Diep, Thomas A. Kocian, Stephen H. Black, Adam M. Kennedy | 2015-11-03 |
| 9132496 | Reducing formation of oxide on solder | Buu Q. Diep, Thomas A. Kocian | 2015-09-15 |
| 9105800 | Method of forming deposited patterns on a surface | Thomas A. Kocian, Buu Q. Diep, Adam M. Kennedy, Stephen H. Black | 2015-08-11 |
| 9093444 | Wafer level package solder barrier used as vacuum getter | Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2015-07-28 |
| 9073298 | Disposable bond gap control structures | Buu Q. Diep | 2015-07-07 |
| 8844793 | Reducing formation of oxide on solder | Buu Q. Diep, Thomas A. Kocian | 2014-09-30 |
| 8809784 | Incident radiation detector packaging | Stephen H. Black, Thomas A. Kocian, Buu Q. Diep | 2014-08-19 |
| 8736045 | Integrated bondline spacers for wafer level packaged circuit devices | Buu Q. Diep, Thomas A. Kocian, Stephen H. Black, Allan M. Kennedy | 2014-05-27 |
| 8454789 | Disposable bond gap control structures | Buu Q. Diep | 2013-06-04 |
| 8153980 | Color correction for radiation detectors | John F. Brady, Athanasios J. Syllaios, Thomas R. Schimert, William L. McCardel | 2012-04-10 |
| 7977208 | Method and apparatus for packaging circuit devices | Billy D. Ables, John Charles Ehmke | 2011-07-12 |
| 7867874 | Method and apparatus for packaging circuit devices | Billy D. Ables, John Charles Ehmke | 2011-01-11 |
| 7655909 | Infrared detector elements and methods of forming same | Thomas R. Schimert, Athanasios J. Syllaios, William L. McCardel | 2010-02-02 |
| 7535093 | Method and apparatus for packaging circuit devices | Billy D. Ables, John Charles Ehmke | 2009-05-19 |
| 7528061 | Systems and methods for solder bonding | Athanasios J. Syllaios, John H. Tregilgas | 2009-05-05 |
| 7514684 | Surface mounted infrared image detector systems and associated methods | — | 2009-04-07 |
| 7462831 | Systems and methods for bonding | Athanasios J. Syllaios, Thomas R. Schimert, William L. McCardel | 2008-12-09 |