Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9390993 | Semiconductor border protection sealant | Sam Ziqun Zhao, Galen Kirkpatrick, Edward Law, Ming Wang Sze | 2016-07-12 |
| 8686558 | Thermally and electrically enhanced ball grid array package | Sam Ziqun Zhao, Edward Law, Marc Papageorge | 2014-04-01 |
| 8310067 | Ball grid array package enhanced with a thermal and electrical connector | Sam Ziqun Zhao | 2012-11-13 |
| 8021927 | Die down ball grid array packages and method for making same | Sam Ziqun Zhao | 2011-09-20 |
| 7893546 | Ball grid array package enhanced with a thermal and electrical connector | Sam Ziqun Zhao | 2011-02-22 |
| 7859101 | Die-up ball grid array package with die-attached heat spreader | Sam Ziqun Zhao | 2010-12-28 |
| 7791189 | Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same | Sam Ziqun Zhao | 2010-09-07 |
| 7786591 | Die down ball grid array package | Sam Ziqun Zhao | 2010-08-31 |
| 7781882 | Low voltage drop and high thermal performance ball grid array package | Chonghua Zhong | 2010-08-24 |
| 7781266 | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages | Sam Ziqun Zhao | 2010-08-24 |
| 7719110 | Flip chip package including a non-planar heat spreader and method of making the same | Sam Ziqun Zhao | 2010-05-18 |
| 7629681 | Ball grid array package with patterned stiffener surface and method of assembling the same | Sam Ziqun Zhao, Edward Law, Marc Papageorge | 2009-12-08 |
| 7582951 | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages | Sam Ziqun Zhao | 2009-09-01 |
| 7566591 | Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features | Sam Ziqun Zhao | 2009-07-28 |
| 7482686 | Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same | Sam Ziqun Zhao | 2009-01-27 |
| 7432586 | Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages | Sam Ziqun Zhao | 2008-10-07 |
| 7405145 | Ball grid array package substrates with a modified central opening and method for making the same | Chong Zhong | 2008-07-29 |
| 7312108 | Method for assembling a ball grid array package with two substrates | Sam Zhao, Imtiaz Chaudhry | 2007-12-25 |
| 7271479 | Flip chip package including a non-planar heat spreader and method of making the same | Sam Ziqun Zhao | 2007-09-18 |
| 7259448 | Die-up ball grid array package with a heat spreader and method for making the same | Tonglong Zhang | 2007-08-21 |
| 7259457 | Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same | Tonglong Zhang | 2007-08-21 |
| 7245500 | Ball grid array package with stepped stiffener layer | Sam Ziqun Zhao | 2007-07-17 |
| 7241645 | Method for assembling a ball grid array package with multiple interposers | Sam Ziqun Zhao | 2007-07-10 |
| 7227256 | Die-up ball grid array package with printed circuit board attachable heat spreader | Sam Ziqun Zhao | 2007-06-05 |
| 7161239 | Ball grid array package enhanced with a thermal and electrical connector | Sam Ziqun Zhao | 2007-01-09 |