Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7132744 | Enhanced die-up ball grid array packages and method for making the same | Sam Ziqun Zhao | 2006-11-07 |
| 7102225 | Die-up ball grid array package with printed circuit board attachable heat spreader | Sam Ziqun Zhao, Brent Bacher | 2006-09-05 |
| 7078806 | IC die support structures for ball grid array package fabrication | Sam Ziqun Zhao | 2006-07-18 |
| 7038312 | Die-up ball grid array package with attached stiffener ring | Sam Zhao, Brent Bacher | 2006-05-02 |
| 7005737 | Die-up ball grid array package with enhanced stiffener | Sam Ziqun Zhao | 2006-02-28 |
| 6989593 | Die-up ball grid array package with patterned stiffener opening | Sam Ziqun Zhao, Brent Bacher | 2006-01-24 |
| 6906414 | Ball grid array package with patterned stiffener layer | Sam Ziqun Zhao | 2005-06-14 |
| 6887741 | Method for making an enhanced die-up ball grid array package with two substrates | Sam Ziqun Zhao, Imtiaz Chaudhry | 2005-05-03 |
| 6879039 | Ball grid array package substrates and method of making the same | Chong Zhong | 2005-04-12 |
| 6876553 | Enhanced die-up ball grid array package with two substrates | Sam Ziqun Zhao, Imtiaz Chaudhry | 2005-04-05 |
| 6861750 | Ball grid array package with multiple interposers | Sam Ziqun Zhao | 2005-03-01 |
| 6853070 | Die-down ball grid array package with die-attached heat spreader and method for making the same | Sam Ziqun Zhao | 2005-02-08 |
| 6825108 | Ball grid array package fabrication with IC die support structures | Sam Ziqun Zhao | 2004-11-30 |