Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400982 | Chip package on package structure, packaging method thereof, and electronic device | Xiaodong Zhang, Yong Guan, Simin Wang | 2025-08-26 |
| 12388059 | Chip package structure and chip packaging method | Xiaodong Zhang, Yong Guan, Heng Li | 2025-08-12 |
| 9237651 | Padless via | — | 2016-01-12 |
| 7985631 | Semiconductor assembly with one metal layer after base metal removal | — | 2011-07-26 |
| 7704800 | Semiconductor assembly with one metal layer after base metal removal | — | 2010-04-27 |
| 7595227 | Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same | — | 2009-09-29 |
| 7411281 | Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same | — | 2008-08-12 |
| 7326061 | Via providing multiple electrically conductive paths | — | 2008-02-05 |
| 7259448 | Die-up ball grid array package with a heat spreader and method for making the same | Reza-ur Rahman Khan | 2007-08-21 |
| 7259457 | Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same | Reza-ur Rahman Khan | 2007-08-21 |
| 7168957 | Via providing multiple electrically conductive paths | — | 2007-01-30 |
| 7094060 | Via providing multiple electrically conductive paths | — | 2006-08-22 |
| 6848912 | Via providing multiple electrically conductive paths through a circuit board | — | 2005-02-01 |